Semiconductor Industry

Application of tungsten and molybdenum products in semiconductor industry

1. Key Components in Semiconductor Manufacturing Equipment

Targets

Used in physical vapor deposition (PVD) or sputtering equipment.

Due to the high melting point and corrosion resistance of W and Mo, they serve as metal targets to deposit thin films for chip interconnects or contact layers.

Electrodes and Heating Elements

Heating elements made of tungsten or molybdenum are used in high-temperature furnaces (such as CVD furnaces and annealing furnaces) to uniformly heat wafers or substrates.

Mo or W wires are used to make precise electrodes that are high-temperature resistant and electrically stable.

2. Wafer Handling and Support Components

Susceptors

In chemical vapor deposition (CVD, MOCVD), Mo or W susceptor plates carry silicon wafers or substrates.

Features: low thermal expansion, high-temperature resistance, and chemical stability.

Support Frames and Holders

Maintain wafer flatness and stability during processing, ensuring uniform film deposition.

3. Vacuum and High-Temperature Environment Applications

Furnace Linings and Shields

Used in vacuum furnaces for silicon wafer annealing, diffusion, or epitaxial growth.

Tungsten and molybdenum can withstand extremely high temperatures (>2000 °C) and are chemically stable in various gases.

Thermal Shields and Reflectors

Reflect heat in high-temperature furnaces and protect other components.

4. Interconnects and Contact Materials

Metal Interconnect Layers (W Plug / Mo Barrier)

Tungsten is commonly used to fill deep vias in chips due to its low resistivity and good thermal stability.

Molybdenum can serve as a substrate or diffusion barrier to prevent reactions with silicon or copper. 

5. Special Thin Films and Coatings

Anti-Contamination and Corrosion-Resistant Coatings

Mo or W thin films can form protective layers inside equipment, extending its service life.

Reflective Coatings

In photolithography, laser processing, or optical components, tungsten and molybdenum thin films are used as reflective or shielding layers.

Summary:
Tungsten and molybdenum products are mainly used for critical components in high-temperature, high-vacuum, and high-precision environments in the semiconductor industry, including targets, heating elements, susceptors, support frames, and chip interconnect and barrier layers. Their high melting point, low thermal expansion, good thermal conductivity, and chemical stability make them indispensable materials in semiconductor manufacturing.